PACKAGE.PDF
| The scope of application | version | upload time | size | |
|---|---|---|---|---|
| 3.6 | 2023-12-20 | 629KB | ||
| Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... | ||||
| download | ||||
| The scope of application | version | upload time | size | |
|---|---|---|---|---|
| 3.6 | 2023-12-20 | 629KB | ||
| Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... | ||||
| download | ||||