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CH573DS1.PDF
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CH573 datasheet. An MCU based on 32-bit RISC-V instruction set for BLE wireless communication. It provides 448K ROM and 18K SRAM, and the minimum power is 0.3uA. It integrates with full-speed USB host and device controller and transceiver, 12-bit ADC, touch-key detection module, RTC, power management, etc. It provides Bluetooth Low Energy protocol stack and API. |
1.12 |
2022-06-29 |
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QingKeV3_Proces...
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QingKe V3 series microprocessor manual, QingKe V3 series microprocessors are self-developed 32-bit general-purpose MCU microprocessors based on standard RISC-V instruction set architecture. This series includes V3A, V3B and V3C, of which V3A supports RV32IMAC standard instruction set extension and V3B/C supports RV32IMCB standard instruction set extension and customized instruction set extension XW. Both of them support single-cycle multiplication and hardware division, in addition to hardware pressure stack (HPE), table-free interrupt (VTF), streamlined 1- and 2-wire debugging interfaces, "WFE" instructions and other special features. In addition, it also supports Hardware Prologue/Epilogue (HPE), Vector Table Free (VTF), streamlined 1-/2-wire debugging interface, and support for "WFE" instruction. |
1.2 |
2024-09-24 |
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WCHISPTool_Setu...
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MCU burning software of CH54x,CH55x,CH56x,CH643x,CH641x,CH57x,CH58x,CH59x,CH32F10x,CH32F20x,CH32V00x,CH32V10x,CH32V20x,CH32V30x,CH32X03x,CH32L10x |
3.6 |
2023-10-18 |
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WCHISPTool_CMD....
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Multi-platform command line tool for WCH MCU burning online, supports firmware download, verification and other operations for series MCU of WCH via USB or serial port. Contains ISP library and demo programs for customized development of ISP tool. Supports CH54x,CH55x,CH56x,CH643x,CH641x,CH57x,CH58x,CH59x,CH32F10x,CH32F20x,CH32V00x,CH32V10x,CH32V20x,CH32V30x,CH32X03x,CH32L10x series MCU chip. |
3.6 |
2023-10-19 |
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PRODUCT_GUIDE.P...
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Electronic selection of product selection manual, please refer to related product technical manual for more technical information. |
3.3 |
2024-07-06 |
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PACKAGE.PDF
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Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... |
3.6 |
2023-12-20 |