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PRODUCT_GUIDE.P... Electronic selection of product selection manual, please refer to related product technical manual for more technical information. 3.3 2024-07-06
PACKAGE.PDF Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... 3.6 2023-12-20