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( 2 )file category | file content | version | upload time |
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Others | |||
PRODUCT_GUIDE.P... | Electronic selection of product selection manual, please refer to related product technical manual for more technical information. | 3.3 | 2024-07-06 |
PACKAGE.PDF | Common package dimensions for CH series ICs: DIP, SKDIP, SDIP, SOP, SSOP, MSOP, QFP, LQFP, QFN, ... | 3.6 | 2023-12-20 |